HENKEL MicroEmission® Cleaner

HENKEL MicroEmission® Cleaner removes adhesive residues from soiled glue pots, pumps, pipes, hoses, applicator nozzles and all other application equipment. Even cracked and charred adhesive residues can be removed. 

Before applying MicroEmission® Cleaner, all adhesive residues should be drained and removed from the glue pots, hoses and other application equipment in need of cleaning. The temperature inside the equipment should be reduced to below 150°C to avoid any chemical reactions. All soiled parts should be covered with MicroEmission® Cleaner. After soaking for a maximum of 8 hours (depending on the degree of soiling), flush all the application equipment several times. The systematic and regular application of MicroEmission® Cleaner maintains your production facility in smooth and cost-effective operation.